NEW ON THE BLOCK
Duplo Launches B2+ Die Cutter

Duplo has introduced its groundbreaking B2 die-cutter, the DSM-1000. Equipped with a state-of-the-art PC-controller, the DSM-1000 offers unparalleled automation, seamlessly performing shape cutting, matrix creasing, perforating, and kiss cutting tasks while efficiently managing cutting waste removal.

One of the key advantages of the DSM-1000 is its ability to open up new revenue streams for commercial printers by expanding their capabilities and enabling them to tap into the burgeoning digital packaging market. Its versatility and ease of use make it an ideal solution for handling the growing demand for premium printed and packaging products in-house.

Moreover, by reducing waste and turnaround times, the DSM-1000 enables businesses to operate more efficiently, ultimately driving greater profitability and competitiveness. Its compatibility with the Duplo B2 Spot UV and foiling solution, the DuSense DDC-8000, further enhances its versatility and suitability for fast-paced environments.

Despite its advanced capabilities, the DSM-1000 boasts a compact footprint, making it suitable for a wide range of businesses without compromising on performance. This ensures that even smaller printing operations can benefit from the efficiency and precision offered by this innovative die-cutter.

The DSM-1000 produces packaging, POP displays, pocket folders, and shaped cards of all varieties and sizes. Featuring a user-friendly PC controller which also drives its automation and productivity. This Duplo B2 die-cutter can handle a wide range of substrates and perform a wide range of finishing including matrix creasing, perforating, kiss cutting and more.

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