swop ready for a restart with interpack alliance

Seeing a comeback of international trade fair business in China, swop (Shanghai World of Packaging) will take place in Shanghai on 22-24 November after a hiatus of three years, offering a platform for the processing and packaging industries.

More than 700 exhibitors and 25.000 trade visitors, both domestic and international, attended the last swop in 2019. The expectations are similarly high for 2023 with a total exhibition area of about 62,000 square metres planned.

Together with Adsale Exhibition Services, Messe Düsseldorf Shanghai is hosting swop under the interpack alliance umbrella brand. Like interpack, this trade fair addresses all core target groups from the sectors of food, beverages, confectionery and baked goods, pharmaceuticals, cosmetics, non-foods and industrial goods. It covers the entire supply chain of the packaging industry. Its scope ranges from production and processing of packaging materials to primary and secondary packaging as well as packaging printing.

The focus of the show is on the topics of circular economy, conservation of resources, digital technologies and product safety as well as fast-moving consumer goods. For the first time, swop 2023 will have the “Green Power Immersive Interactive Exhibitor Area”, a platform for companies to present their sustainable packaging solutions for the circular economy. Progressing digitalization is of equal concern to the packaging industry and will also be a key topic at swop.

The FMCG Infinity Zone is a cooperation between swop and PKG Family, created as an efficient communication platform for fast-moving consumer goods (FMCG). Packaging plays a key part here. At swop, the newest packaging materials, ideas, technologies and design will be exhibited in this context. More than 300 exhibitors will present their products in this area.

As a member of the interpack alliance, in addition to continuing to exhibit the packaging industry chain, swop will discuss industry-leading keywords with packers, brands, OEM/ODM, including lightweight, light assets, youth, intelligence, personalization, new materials, new technologies, sustainability, new design trends and other popular topics, sharing packaging cutting-edge concepts and technologies.


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