The 6th International Summit for Packaging Industry (ISPI 2026), held alongside the IIP
Packathon in New Delhi from March 12 to 14, 2026, delivered a rich programme of
presentations and discussions centred on the theme Packaging 5S-AI, safe, secure,
standardised, smart, sustainable and AI-driven packaging.
The inaugural address by Ajay Bhadoo set a confident tone, highlighting how automation
and artificial intelligence are transforming productivity, cutting waste and building more resilient supply chains, while positioning smart and standardised packaging as a driver of
India’s global competitiveness.
Technical sessions and panel discussions tackled the full spectrum of contemporary industry
challenges, from sustainable material innovation and circular economy practices to the
integration of AI and automation in packaging workflows. Sessions on smart, sensor-based
and traceable packaging solutions drew particular interest, reflecting the sector’s
accelerating shift toward interactive and data-driven formats.
Industry leaders including Ashok Chaturvedi, alongside international voices such as Luciana
Pellegrino, brought global perspectives to the conversation, emphasising collaborative
innovation, regulatory alignment and sustainable growth. Experts also addressed carbon
footprint reduction, bio-based and recyclable materials, anti-counterfeiting technologies, and
supply chain optimisation.
A defining strength of the summit was its grounding in practice, speakers drew on case
studies and real-world implementations, making the sessions directly relevant to converters,
brand owners and print-packaging professionals. Together with the Packathon, ISPI 2026
affirmed its standing as a platform where ideas, innovation and industry leadership
converge.
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